New finer-grained ceramic substrate material boasts 20% increase in flexural strength and other benefits over traditional materials. GRAND JUNCTION, Colo., June 1 /PRNewswire/ -- CoorsTek, a large technical ceramics manufacturer and long-time provider of electronic components, today introduced its new DuraStrate thick-film ceramic substrates. Developed specifically for improved performance in thick-film substrates, this new material offers significant performance advantages over standard, widely-available ceramic substrates. Specifically, CoorsTek is employing a finer-grain (1.5 to 2.0 micron) microstructure material -- chiefly responsible for a 20% increase in biaxial flexural strength over traditional materials, improved thick-film performance, consistent thicknesses, improved camber flatness, and better aged adhesion. This enhanced durability should translate to improved process yields, longer product life, and superior reliability. CoorsTek currently offers the DuraState ceramic for only the very thin (10-15 mil) varieties of thick-film substrates.
