PHILADELPHIA--(BUSINESS WIRE)--For the fourth time, Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), has received a New Product Introduction (NPI) Award from Printed Circuit Design and Fab (PCD&F) Magazine for its MICROFILL™ platform, this time with MICROFILL™ LVF 4 Acid Copper. As the Internet of Things advances, speedy and stable signal transmission across wireless networks is critical. Dow MICROFILL LVF 4 Acid Copper offers excellent microvia filling and panel plating uniformity for circuit boards to enhance signal transmission between smart devices. Dow MICROFILL solutions have won four NPI Awards from PCD&F, including EVF Solution for microvia fill, THF Solution for through-hole fill, and LVF 3 and LVF 4 Solutions for blind via fill in High-Density-Interconnect circuit boards and IC substrates since 2009. “The developments in plating achieved by Dow Electronic Materials with its MICROFILL line are nothing short of remarkable,” said Mike Buetow, editor-in-chief of PCD&F. “We are thrilled to recognize Dow for its continued achievement.” The NPI Award, in its eighth year, recognizes the leading new products from the previous year. Awards are selected by an independent panel of industry engineers. Dow Electronic Materials will showcase MICROFILL LVF 4 Acid Copper and other innovations in CPCA show on March 17-19 and CTEX, JPCA, Productronica, TPCA, and HKPCA shows in 2015.
